Micro scale deformational behavior of metals is improved upon increasing the room temperature. Further, the drawbacks of micro forming caused by size effects are reduced significantly. In the current work, investigation on the material behavior of copper at elevated temperature ranging from room temperature to 200 ℃ is conducted. On the experimental part, a novel micro extrusion die set assembly has been developed along with temperature assistance, where the specimen is heated within the die assembly to study deformation behavior. When the forming temperature is raised, an enlargement of the forming limits is achieved along with a significant reduction in extrusion force. Further, the flow of material inside the die orifice was more uniform, and the micro pin showed a good replication of the die dimensions with homogeneous material deformation. During the increase of extrusion temperature and lubrication conditions (diamond-like carbon coating), the micro pin is more complete with higher dimensional accuracy and surface finish. The investigation on the influence of temperature showed that there is a reduction in microhardness of samples compared to the hardness of samples extruded at room temperature. However, there is a significant reduction of scattering due to homogenizing effect.